In this to-be process, 3D Modeling, Meshing, Computing, Results Analytics, and Business Collaborations are seamlessly included on a single digital platform. It creates difficulties to update design changes and simulation results and poses a great challenge to data traceability, not to mention the potential risk of introducing versioning errors. To keep the model size in check, the mesh used for simulation cannot be very refined, making it difficult to capture details in stress and strain distributions.Īs a result, the outcome of fatigue life predictions can be unsatisfactory sometimes. These model abstractions can compromise the fidelity and accuracy of the physics simulation and lengthen the design- simulation cycle. In addition, limited by the solving capabilities, the model size has to be reduced by removing some noncritical features and applying symmetry assumptions, which often are not necessarily accurate.

The development and maintenance of these customized tools require some programming skills that Design Engineers usually lack. Under thermal cyclic loading, cracks can initiate and grow near voids and other defects, as well as along the interface of solder balls and conductive pads, ultimately leading to the malfunctioning and failure of the electronic module.Ĭurrently, the BGA design and simulation are carried out by Design Engineers and Simulation Specialists, separately, facing many challenges. Solder joints are one of the smallest parts that can cost automotive OEMs millions of dollars. Analytic Solver Platform Manual Work For.

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